Samsung Galaxy A6 2018 SM-A600G U10 EMMC DUMP (Dead Boot Repair) | Firmware Support IMEI & Patch
Ditulis pada
Daftar Isi
SM-A600G U10 EMMC DUMP (Dead Boot Repair) | Firmware Support IMEI & Patch
selamat malam kawanku , jumpa lagi dengan kami ahmadservicecenter.com ,selamat datang kembali di website tercinta kita ini
pada kesempatan kali ini saya merangkum file emmc samsung A600G / A6 2018 U10 Binary 10
binary ini paling terbaru untuk saat ini yang kami miliki A600GDXUACVB2
untuk dump sm-a600g U10/UA ini backup 1GB ya..
seperti biasa kami menggunakan tool ufi box untuk proses penanganan nya ,
emmc yang kami gunakan berkapasitas 32GB, untuk cara isi file seperti yang kita ketahui
siapkan emmc , factory reset emmc agar bersih kemudian masukan file :
ex_csd , boot1 boot2 ,userarea 1GB , sesudah write masuk tab partition restore PrimaryGPT &&
kemudian pasang emmc nya kalem saja , jika sudah nyalakan ,masuk recovery factory reset
Link Download File
File Dump U10
SM-A600G(QP1A.190711.020.A600GDXUACVB2-10-QP1A.190711.020)[KLMBG2JETD-B041_A29D8CA7]File NVDATA
file nv data exynos untuk mengatasi baseband uknownfile ROOT_A600GDXUACVB2
File Firmware Support imei & Patch
file firmware SM-A600G_Full Repair 4_A600GDXUACVB2_facfile modem CP UA Support untuk imei repair Flash CP
CP_A600GDXUACUH1_CP20031593_CL20847361_QB42393410_REV00_user_low_ship.tarJika tidak bisa backup security imei dan baseband uknown , tenang kami ada solusi
Silahkan Hubungi kami ,
ahmadservice menyediakan jasa remot service jarak jauh melalui teamviewer.com
alahkan baiknya read via isp di bawah ini terlebih dahulu untuk backup security imei :
full isp pinout samsung sm-a600g / sm-a600f :
semoga done juga kawan kawanku ..
Log UFI
Connection status: XHCI:HUB3[#5]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8081-5464
Boot version: 1.03, FW version: 1.14 (Aug 25 2021 04:56:05)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: BJTD4R (0x424a54443452), rev: 0x00, serial number: 0xA29D8CA7
Manufacturing date: Feb 2019
CID: 15010042 4A544434 5200A29D 8CA726A6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
Firmware version: 0x02
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 12]
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Secure Feature support: 0x55
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x01
Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x10
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
User area write protection: 0x10
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
ANDROID System Info:
platform: universal7870, cpu abi: armeabi-v7a
board: exynos7870, name: a6ltedx
brand: samsung, model: SM-A600G
build id: QP1A.190711.020, version: 10 [Android 10] (QP1A.190711.020.A600GDXUACVB2)
build description: a6ltedx-user 10 QP1A.190711.020 A600GDXUACVB2 release-keys
crypto state: encrypted?
eMMC selected: [SAMSUNG] KLMBG2JETD-B041/32GB (BGA153)
